The effect of nano-void on deformation behaviour of Al-Cu intermetallic thin film compounds

Author: Yedla Natraj   Meraj Md.   Gupta Pradeep   Sarat Venumbakkam   Kabi Amar Jyoti   Pal Snehanshu  

Publisher: Edp Sciences

E-ISSN: 2271-3654|112|5|505-505

ISSN: 2271-3646

Source: Metallurgical Research & Technology (formerly Revue de Métallurgie), Vol.112, Iss.5, 2015-10, pp. : 505-505

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Abstract