Chapter
2 - Interfacing sensors to microcontrollers: a direct approach
2.2.1.1 Single resistive sensor
2.2.1.2 Differential resistive sensor
2.2.1.3 Bridge-type resistive sensor
2.2.2.1 Single capacitive sensor
2.2.2.2 Lossy capacitive sensor
2.2.2.3 Differential capacitive sensor
2.2.2.4 Bridge-type capacitive sensor
2.3.1 General description
2.3.2 Time-interval measurement
2.4.1 Operating principle
2.4.2 Circuits for resistive sensors
2.4.2.1 Single resistive sensor
2.4.2.2 Differential resistive sensor
2.4.2.3 Bridge-type resistive sensor
2.4.3 Circuits for capacitive sensors
2.4.3.1 Single capacitive sensor
2.4.3.2 Lossy capacitive sensor
2.4.3.3 Differential capacitive sensor
2.4.3.4 Bridge-type capacitive sensor
2.5.1 Temperature measurement
2.5.2 Position measurement
2.5.3 Magnetic field measurement
2.5.4 Relative humidity measurement
Sources of further information and advice
3 - Smart temperature sensors and temperature sensor systems
3.2 Measuring temperature, temperature differences, and temperature changes in industrial applications
3.3 Temperature-sensing elements
3.3.2 Temperature sensor characteristics of bipolar junction transistors
3.3.3 ΔVBE temperature sensors
3.3.4 Bipolar junction transistors in complementary metal-oxide semiconductor (CMOS) technology
3.4 Basic concepts of smart temperature sensors
3.4.1 Architectures of smart temperature sensor systems
3.4.2 Temperature sensors with a duty-cycle-modulated (DEM) output
3.5 Methods to improve the accuracy of CMOS smart temperature-sensor systems
3.5.1 Dynamic element matching
3.6 Principles of BJT-based smart temperature sensors with DCM
3.7 Signal processing of duty cycle modulated signals
3.7.1 Three methods of averaging
3.7.1.1 First type of averaging: best accuracy at any speed
3.7.1.2 Second type of averaging: simplest method
3.7.1.3 Third method of averaging: best accuracy at intermediate and low speeds
3.8 Fabrication and test results
3.8.2 Accuracy over temperature range and supply voltage range
3.8.4 Packaging shift and long-term stability
3.8.5 Performance summary
3.8.6 Simple systems with digital and analog signal processing
4 - Capacitive sensors for displacement measurement in the subnanometer range
4.2 Challenges for subnanometer displacement measurement with capacitive sensors
4.3 Offset capacitance cancellation technique
4.4 Capacitance-to-digital converter with offset capacitance cancellation and calibration functions
5 - Integrated inductive displacement sensors for harsh industrial environments
5.1 Why inductive displacement sensors?
5.2 Principle of operation and practical limitations for eddy-current sensors
5.2.1 Sensor operation principle
5.2.2 Limitations of eddy-current sensors
5.2.2.2 Parasitic effects
5.2.2.3 Limited sensing coil quality factor
5.2.2.4 Frequency dependence
5.3 Design requirements in precision industrial applications
5.4 State-of-the-art eddy-current sensor interfaces
5.4.1 Utilizing external switched-capacitor oscillator and LC resonator
5.4.2 Relaxation oscillator-based interface
5.5 Eddy-current sensor interfaces with LC oscillator and ratiometric measurement
5.5.1 Precision peak detection-based eddy-current sensor interface
5.5.2 Trade-offs in mixer-based interfaces
5.5.3 Synchronous detection-based eddy-current sensor interface
5.5.3.1 Sensor interface for mm-range displacement measurement
5.5.3.2 Sensor interface for μm-range displacement measurement
5.6 Summary and design perspectives
5.A Sensing coil design aspects
5.A.3 Self-resonance frequency
6 - Magnetic sensors and industrial sensing applications
6.1.2 Magnetoresistance effect
6.1.3 Giant magnetoresistance
6.1.4 Tunneling magnetoresistance
6.1.5 MR/Hall effect-based angle sensors
6.1.6 Through-shaft magnetic angle sensor
6.1.6.1 Variable reluctance–Hall effect-based angle sensor
6.1.6.2 Signal conditioning circuit and sensor calibration
7 - Advanced silicon radiation detectors in the vacuum ultraviolet and the extreme ultraviolet spectral range
7.1 Introductory overview
7.2 Challenges for radiation detection in the VUV and EUV spectral ranges
7.3 Device solutions for radiation detection in the VUV and EUV spectral ranges
7.4 Methods of radiometric investigation and characterization
7.5 Spectral responsivity and radiation hardness of VUV and EUV radiation detectors
8 - Advanced interfaces for resistive sensors
8.2.1 Examples of resistive sensors
8.2.1.1 Resistive temperature detectors
8.2.1.2 Light-dependent resistors
8.2.1.3 Resistive gas sensors
8.2.2 Parasitic capacitance
8.3 Voltamperometric resistance estimation
8.3.1 Implementation in smart sensors
8.3.2 Parasitic capacitance issues
8.3.3 Calibration procedures
8.4 Resistance-to-time conversion methods
8.4.1 Oscillator-based systems
8.4.1.1 Parasitic capacitance issues
8.4.1.2 The problem of long measuring times
8.4.2 Systems with constant sensor excitation voltage
8.4.2.1 Long measuring time problem
8.4.2.2 Direct ramp slope estimation
8.4.2.3 Parasitic capacitance estimation
8.5 Industrial-related aspects
8.6 Conclusion and future trends
9 - Reconfigurable ultrasonic smart sensor platform for nondestructive evaluation and imaging applications
9.2 Fundamentals of ultrasonic sensing and pulse-echo measurements
9.3 Reconfigurable ultrasonic smart sensor platform design
9.3.1 System features and user interface
9.3.2 System response and real-time operational requirements
9.3.3 Reconfigurable ultrasonic smart sensor platform architecture
9.3.4 Analog-to-digital converter to field-programmable gate array interface
9.4 Algorithms used in evaluation of reconfigurable ultrasonic smart sensor platform
9.4.2 Split-spectrum processing
9.4.3 Chirplet signal decomposition
9.5 Hardware realization of ultrasonic imaging algorithms using reconfigurable ultrasonic smart sensor platform
9.5.1 Averaging implementation
9.5.2 Split-spectrum processing implementation
9.5.3 Chirplet signal decomposition implementation
9.5.4 Resource usage and timing constraints
9.8 Sources of further information and advice
10 - Advanced optical incremental sensors: encoders and interferometers
10.2 Displacement interferometers
10.2.1 Basics of displacement interferometry
10.2.1.1 Homodyne interferometers (detection)
10.2.1.2 Heterodyne interferometers (detection)
10.2.2 Interferometer concepts
10.2.2.1 Linear interferometer
10.2.2.2 Plane mirror interferometer
10.2.3 Phase detection and interpolation
10.3 Sources of error and compensation methods
10.3.1 Setup dependent error sources
10.3.1.4 Target uniformity
10.3.1.5 Mechanical stability
10.3.2 Instrument dependent error sources
10.3.2.1 (Split) frequency
10.3.2.3 Electronics and data age
10.3.2.4 Periodic deviation
10.3.3 Environment dependent error sources
10.3.3.1 Thermal effects on the interferometer
10.3.3.2 Refractive index of air
10.4.1 Imaging incremental encoder
10.4.2 Interferential encoders
10.4.2.1 Diffraction physics
10.4.2.3 Schematic setups
10.4.2.5 Tilt sensitivity
10.4.2.6 Practical example
10.5 Design considerations
10.5.2 Grating scale errors
10.5.6 Multiaxis encoder systems
10.6 Current and future trends
11 - Microfabrication technologies used for creating smart devices for industrial applications
11.2 Microelectromechanical systems design and modeling
11.3.5 Piezoelectric and piezoresistive materials
11.4 Microfabrication processes
11.4.2.1 Chemical deposition processes
11.4.2.2 Physical deposition processes
11.4.4 Bonding techniques
11.4.4.3 Eutectic bonding
11.5.1 Simulations and fabrication materials
11.5.4 Boundary and initial conditions
11.5.5 Results of the simulations
12 - Microactuators: design and technology
12.2 Considerations in mechanisms selection
12.2.1 Size and physical properties
12.2.2 Output force and displacement range
12.2.3 Actuation resolution and sensing
12.2.4 Fabrication and material selection
12.3 Electrostatic systems
12.3.1 Electrostatic actuation
12.3.2 Common features and designs
12.3.2.1 Comb-drive actuators
12.3.2.2 Parallel-plate actuator
12.3.2.3 Scratch drive actuator
12.4 Electrothermal systems
12.4.1 Electrothermal actuation
12.4.2 Common features and designs
12.4.2.1 U-shaped (pseudo-bimorph) beam
12.4.2.2 V-beam (chevron/bent-beam) actuator
12.4.2.3 Bimorph actuator
12.4.2.4 Electrothermal actuators based on unconventional materials
12.4.2.5 Compliant mechanism
12.5 Piezoelectric systems
12.5.1 Piezoelectric actuation
12.5.2 Common features and designs
12.5.2.1 Cantilever-type piezoelectric actuators
12.5.2.2 Membrane-type piezoelectric actuators
12.5.2.3 Compliant mechanism
13 - Microreaction chambers
13.2 Basics of microfluidics
13.3 Components of a microfluidic system
13.3.3.1 Active microfluidic mixers
13.3.3.2 Passive microfluidic mixers
13.3.4 Measurement and sensing
13.4.1 Example: ring-shaped reactor
13.4.1.2 Control interface
13.4.2 Example: coin-shaped reactor
13.4.3 Example case: NanoTek
13.4.4 Other microreactors
14 - Dynamic behavior of smart microelectromechanical systems in industrial applications
14.2 Resonant frequency response of smart microelectromechanical systems vibrating structures
14.3 Quality factor and the loss coefficient of smart microelectromechanical systems vibrating structures
14.4 Industrial applications
14.4.1 Resonant accelerometer
14.4.2 Mass detection sensor
15 - Microelectromechanical systems integrating motion and displacement sensors
15.2 Technical description of MEMS motion sensors: MEMS accelerometer
15.2.2 Differential capacitive sensing
15.2.3 Thermomechanical noise
15.2.4 Electronic readout
15.2.5 Frequency-modulated accelerometers
15.3 Microelectromechanical systems gyroscope
15.3.2 Mechanical sensitivity
15.3.3 Intrinsic device noise
15.3.4 References to resonant gyroscopes
15.4 Microelectromechanical systems magnetometer
15.4.1 Working principle and mechanical sensitivity
15.4.2 Thermomechanical noise and intrinsic resolution
15.4.3 Effects of the readout electronics
15.5 Conclusion and future trends
15.5.1 Combination of inertial measurement units with proximity sensors
16 - Microelectromechanical systems print heads for industrial printing
16.2 Electrohydrodynamic print head droplet ejection
16.2.1 Principle of electrohydrodynamic droplet ejection
16.2.2 Various droplet ejection modes
16.2.3 Configuration of the electrohydrodynamic print head
16.3 Electrohydrodynamic smart printing system
16.3.1 Electrohydrodynamic printing system
16.3.2 Control of the pattern resolution and thickness
16.3.3 Repeatability and stability
16.3.4 Electrohydrodynamic multihead printing system
16.4 Case study: electrohydrodynamic printing applications
17 - Photovoltaic and fuel cells in power microelectromechanical systems for smart energy management
17.2 Photovoltaic mini-generators
17.2.1 Photovoltaic working principles
17.2.1.1 Photocurrent and spectral response
17.2.1.2 Main photovoltaic electrical parameters
17.2.1.3 Photovoltaic modules
17.2.2 Mini-modules technologies
17.2.2.1 Multichip module technology
17.2.2.2 Silicon-on-insulator technology
17.2.2.3 Fusion-bonding technology
17.3 Applications of photovoltaic mini-generators
17.3.1 Telesupplying bioimplantable devices
17.3.2 Driving microelectromechanical systems switches
17.4.1 Fuel cell principles and classification
17.4.2 Microelectromechanical systems–based polymer electrolyte membrane FC
17.5 Applications of microfuel cells
17.6 Smart energy management with sun sensors
17.6.1 Principles and structure of a sun sensor
17.6.1.1 Analog sun sensor
17.6.1.2 Digital sun sensor
17.6.2 Analog sun sensor manufacturing
17.6.3 Sun sensor strategy for energy management
18 - RF-MEMS for smart communication systems and future 5G applications
18.2 Evolution of RF-MEMS and of market expectations
18.3 RF-MEMS in the emerging 5G scenario
18.4 RF-MEMS technology: a general overview
18.5 RF-MEMS technology for capacitive microdevices
18.6 RF-MEMS technology for ohmic microdevices
18.7 RF-MEMS-based circuits for smart communication systems
18.9 RF-MEMS power capability
18.10 Cointegration of RF-MEMS-based circuits with integrated circuits
19 - Smart acoustic sensor array system for real-time sound processing applications
19.2 Microelectromechanical systems microphones
19.3 Fundamentals of acoustic sensor arrays and applications
19.4 Design and implementation of smart acoustic microelectromechanical systems array
19.5 System implementation of AMA and CAPTAN
19.6 Smart acoustic sensor array system operation
19.7 Smart acoustic sensor array system calibration
19.8 Sensor array for time-of-flight measurements
19.9 3D sound source localization
19.10 Smart acoustic sensor array system for mapping of the heart sound
Smart Sensors and MEMS
：Intelligent Sensing Devices and Microsystems for Industrial Applications
( 2 )
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
