On the Elastodynamic Response of Thick Multilayered Plates Subjected to Impact Loads

By Lange K.A.   Bottega W.J.  

Journal of Sound and Vibration, Vol. 211, Iss. 1, 1998-03 ,pp. : 39-93

Academic Press

Access to resources Recommend Favorite

Silicon Wafer Surface-Temperature Monitoring System for Plasma Etching Process

By Yamada Y.  

International Journal of Thermophysics, Vol. 32, Iss. 7-8, 2011-08 ,pp. : 1457-1466

Springer Publishing Company

Access to resources Recommend Favorite

Mini-UAV Based Sensory System for Measuring Environmental Variables in Greenhouses

By Roldán Juan Jesús   Joossen Guillaume   Sanz David   Cerro Jaime del   Barrientos Antonio  

Sensors, Vol. 15, Iss. 2, 2015-02 ,pp. : 3334-3350

MDPI

Access to resources Recommend Favorite

Imaging of Electrically Detected Magnetic Resonance of a Silicon Wafer

By Sato T.   Yokoyama H.   Ohya H.   Kamada H.  

Journal of Magnetic Resonance, Vol. 153, Iss. 1, 2001-11 ,pp. : 113-116

Academic Press

Access to resources Recommend Favorite

Wafer bonding solution to epitaxial graphene–silicon integration

By Dong Rui   Guo Zelei   Palmer James   Hu Yike   Ruan Ming   Hankinson John   Kunc Jan   Bhattacharya Swapan K   Berger Claire   de Heer Walt A  

Journal of Physics D: Applied Physics, Vol. 47, Iss. 9, 2014-03 ,pp. : 94001-94008

IOP Publishing

Access to resources Recommend Favorite