Cooling of high power LED chip by boiling on the longitudinal finned surfaces

Publisher: Edp Sciences

E-ISSN: 2261-236x|84|issue|00037-00037

ISSN: 2261-236x

Source: MATEC Web of conference, Vol.84, Iss.issue, 2016-11, pp. : 00037-00037

Access to resources Favorite

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract