Study on Copper Particle Removal from Silicon Surface Based on Binary Systems Consisting of High Pressure Carbon Dioxide and Solvents

Publisher: Trans Tech Publications

E-ISSN: 1662-9795|2016|719|69-73

ISSN: 1013-9826

Source: Key Engineering Materials, Vol.2016, Iss.719, 2017-01, pp. : 69-73

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Abstract