Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging

Author： Goh Chwee Sim   Chong Wee Ling Eddy   Lee Teck Kheng   Breach Christopher  

Publisher： MDPI

E-ISSN： 2073-4352|3|3|391-404

ISSN： 2073-4352

Source： Crystals, Vol.3, Iss.3, 2013-07, pp. : 391-404

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