Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging

Author: Cai Siyu   Chen Tijun   Zhang Xuezheng  

Publisher: MDPI

E-ISSN: 2075-4701|6|12|311-311

ISSN: 2075-4701

Source: Metals, Vol.6, Iss.12, 2016-12, pp. : 311-311

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Abstract