Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry

Author: Matteucci Marco   Heiskanen Arto   Zór Kinga   Emnéus Jenny   Taboryski Rafael  

Publisher: MDPI

E-ISSN: 1424-8220|16|11|1795-1795

ISSN: 1424-8220

Source: Sensors, Vol.16, Iss.11, 2016-10, pp. : 1795-1795

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Abstract