Microstructure and Thermal Physical Properties of a β­SiCp/Al Composite for Electronic Packaging Produced by Powder Metallurgy

Publisher: Trans Tech Publications

E-ISSN: 1662-9795|2017|727|565-570

ISSN: 1013-9826

Source: Key Engineering Materials, Vol.2017, Iss.727, 2017-03, pp. : 565-570

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Abstract