Electroless Deposition of NiMoB Diffusion Barrier Layer Film for ULSI-Cu Metallization

Publisher: Trans Tech Publications

E-ISSN: 1662-9795|2017|727|900-906

ISSN: 1013-9826

Source: Key Engineering Materials, Vol.2017, Iss.727, 2017-03, pp. : 900-906

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content