Publisher: Trans Tech Publications
E-ISSN: 1662-9795|2017|737|214-219
ISSN: 1013-9826
Source: Key Engineering Materials, Vol.2017, Iss.737, 2017-07, pp. : 214-219
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
The compression stress-strain behavior of Sn-Ag-Cu solder
By Vianco Paul Rejent Jerome Martin Joseph
JOM, Vol. 55, Iss. 6, 2003-06 ,pp. :
By Hyatt C. Magee K. Betancourt T.
Metallurgical and Materials Transactions A, Vol. 29, Iss. 6, 1998-06 ,pp. :