Investigating the Deformation, Breakage and Number on Conductive Particle of Flim-on-Glass Packaging Using Anisotropic Conductive Film Bonding

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2017|886|97-101

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2017, Iss.886, 2017-04, pp. : 97-101

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