Numerical Simulation of Temperature Field and Microstructure of a Wide Copper Plate during Warm Mold Continuous Casting

E-ISSN： 1662-9752|2017|898|1289-1299

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2017, Iss.898, 2017-07, pp. : 1289-1299

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