Effect of Bonding Temperature on Microstructure Development during Transient Liquid Phase Bonding of Ti₂AlNb Alloy Using Ti-Zr-Cu Based Filler Alloy

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2017|898|1247-1253

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2017, Iss.898, 2017-07, pp. : 1247-1253

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