Analysis of the Structure and Thermal Stability of Cu@Si Nanoparticles

Publisher： Trans Tech Publications

E-ISSN： 1422-6375|2018|30|52-59

ISSN： 1422-6375

Source： Journal of Metastable and Nanocrystalline Materials, Vol.2018, Iss.30, 2018-02, pp. : 52-59

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