Analysis of Damage of Solder Joint of Heat Exchanger

Publisher： Trans Tech Publications

E-ISSN： 1662-9779|2017|270|63-67

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2017, Iss.270, 2017-12, pp. : 63-67

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Failure Analysis of Ethanol Vaporizer Heat Exchanger Tubes

By Sanders S.  

Journal of Failure Analysis & Prevention, Vol. 13, Iss. 3, 2013-06 ,pp. : 328-332

Springer Publishing Company

Access to resources Recommend Favorite

Solder joint degradation and detection using RF impedance analysis

By Bin Yao   Yudong Lu   Ming Wan  

Soldering & Surface Mount Technology, Vol. 25, Iss. 1, 2013-02 ,pp. : 25-30

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The Simulation and Analysis of Current Crowding and Joule Heat in Flip Chip Solder Bumps

By  

Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. : 319-324

Trans Tech Publications

Access to resources Recommend Favorite

A cryogenic heat exchanger with bypass and throttling and its thermodynamic analysis

By  

IOP Conference Series: Materials Science and Engineering, Vol. 101, Iss. 1, 2015-12 ,pp. : 1276-1283

IOP Publishing

Access to resources Recommend Favorite

Numerical modelling of solder joint formation

By Bailey Chris   Wheeler Daniel   Cross Mark  

Soldering & Surface Mount Technology, Vol. 10, Iss. 2, 1998-02 ,pp. : 6-13

Emerald Group Publishing Ltd

Access to resources Recommend Favorite