The Packing of Helical and Zigzag Chains and Distribution of Interstitial Voids in Expanded Liquid Se near the Semiconductor to Metal Transition

Publisher： Edp Sciences

E-ISSN： 2100-014x|151|issue|01003-01003

ISSN： 2100-014x

Source： EPJ Web of Conference, Vol.151, Iss.issue, 2017-08, pp. : 01003-01003

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