Publisher: Trans Tech Publications
E-ISSN: 1662-9752|2018|924|401-404
ISSN: 0255-5476
Source: Materials Science Forum, Vol.2018, Iss.924, 2018-07, pp. : 401-404
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Pt:Ti Diffusion Barrier, Interconnect, and Simultaneous Ohmic Contacts to n- and p-Type 4H-SiC
Materials Science Forum, Vol. 2018, Iss. 924, 2018-07 ,pp. :
Study of Ti/Al/Ni Ohmic Contacts to p-Type Implanted 4H-SiC
Materials Science Forum, Vol. 2018, Iss. 924, 2018-07 ,pp. :
Low Temperature Ni-Al Ohmic Contacts to p-Type 4H-SiC Using Semi-Salicide Processing
Materials Science Forum, Vol. 2018, Iss. 924, 2018-07 ,pp. :
Low Resistance Ti5Si3/TiC Ohmic contact on Ion-Implanted n-Type 4H-SiC C Face
Materials Science Forum, Vol. 2018, Iss. 924, 2018-07 ,pp. :
Formation of Ohmic Contacts to n-Type 4H-SiC at Low Annealing Temperatures
Materials Science Forum, Vol. 2018, Iss. 924, 2018-07 ,pp. :