Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges †

Author： Liao Meng-Chieh Huang Pu-Shan Lin Yi-Hsien Tsai Ming-Yi Huang Chen-Yu Huang Te-Chin

Publisher： MDPI

E-ISSN： 2076-3417|7|7|739-739

ISSN： 2076-3417

Source： Applied Sciences, Vol.7, Iss.7, 2017-07, pp. : 739-739

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