Thermal Sensitive Shape Memory Behavior of Epoxy Composites Reinforced with Silicon Carbide Whiskers

Author： Wang Yongkun   Tian Wenchao   Liu Xiaohan   Ye Junjie  

Publisher： MDPI

E-ISSN： 2076-3417|7|1|108-108

ISSN： 2076-3417

Source： Applied Sciences, Vol.7, Iss.1, 2017-01, pp. : 108-108

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