Crack Extension and Possibility of Debonding in Encapsulation-Based Self-Healing Materials

Author: Li Wenting   Jiang Zhengwu   Yang Zhenghong  

Publisher: MDPI

E-ISSN: 1996-1944|10|6|589-589

ISSN: 1996-1944

Source: Materials, Vol.10, Iss.6, 2017-05, pp. : 589-589

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Abstract