High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor

Author: Wang Liying   Du Xiaohui   Wang Lingyun   Xu Zhanhao   Zhang Chenying   Gu Dandan  

Publisher: MDPI

E-ISSN: 1424-8220|17|3|599-599

ISSN: 1424-8220

Source: Sensors, Vol.17, Iss.3, 2017-03, pp. : 599-599

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