Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors

Author: Hera Daniel   Berndt Armin   Günther Thomas   Schmiel Stephan   Harendt Christine   Zimmermann André  

Publisher: MDPI

E-ISSN: 1424-8220|17|7|1511-1511

ISSN: 1424-8220

Source: Sensors, Vol.17, Iss.7, 2017-06, pp. : 1511-1511

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Abstract