Influence of Non-Metallic Particles Addition on Wettability, Intermetallic Compound Formation and Microhardness of Sn-0.7Cu Lead Free Solder Paste

Publisher： Trans Tech Publications

E-ISSN： 1662-9779|2018|280|169-174

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2018, Iss.280, 2018-09, pp. : 169-174

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