Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate

Author： Mookam Niwat  

Publisher： Edp Sciences

E-ISSN： 2261-236x|192|issue|01024-01024

ISSN： 2261-236x

Source： MATEC Web of conference, Vol.192, Iss.issue, 2018-08, pp. : 01024-01024

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