Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni3Al based Superalloy IC10

Publisher： Edp Sciences

E-ISSN： 2261-236x|206|issue|03004-03004

ISSN： 2261-236x

Source： MATEC Web of conference, Vol.206, Iss.issue, 2018-09, pp. : 03004-03004

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