Modeling of the ecological separation process of printed circuit boards

E-ISSN： 2261-236x|210|issue|01004-01004

ISSN： 2261-236x

Source： MATEC Web of conference, Vol.210, Iss.issue, 2018-10, pp. : 01004-01004

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Approach to detecting latent defects of the printed circuit boards thin-filmed coatings

MATEC Web of conference, Vol. 194, Iss. issue, 2018-08 ,pp. : 01006-01006

Edp Sciences

Access to resources Recommend Favorite

Rock Wool and Printed Circuit Boards (PCBs) as Partial Fine Aggregate Replacements in Cement Mortar

Key Engineering Materials, Vol. 2018, Iss. 775, 2018-09 ,pp. : 567-575

Trans Tech Publications

Access to resources Recommend Favorite

Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

By Yi Pan Xiao Kui Ding Kangkang Dong Chaofang Li Xiaogang

Materials, Vol. 10, Iss. 2, 2017-02 ,pp. : 137-137

MDPI

Access to resources Recommend Favorite

Corrosion Behavior of Silver-Plated Circuit Boards in a Simulated Marine Environment with Industrial Pollution

By Xiao Kui Yi Pan Yan Lidan Bai Ziheng Dong Chaofang Dong Pengfei Gao Xiong

Materials, Vol. 10, Iss. 7, 2017-07 ,pp. : 762-762

MDPI

Access to resources Recommend Favorite

Metal Injection Molding Process Parameters as A Function of Filling Performance of 3D Printed Polymer Mold

MATEC Web of conference, Vol. 225, Iss. issue, 2018-11 ,pp. : 06004-06004

Edp Sciences

Access to resources Recommend Favorite