The Use of Spatial Voids in the Formation of High-Rise Buildings Architecture

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2018|931|443-450

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2018, Iss.931, 2018-10, pp. : 443-450

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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Abstract