Correlations between Thermal Loads during Grind-Hardening and Material Modifications Using the Concept of Process Signatures

Author： Kolkwitz Benjamin   Kohls Ewald   Heinzel Carsten   Brinksmeier Ekkard  

Publisher： MDPI

E-ISSN： 2504-4494|2|1|20-20

ISSN： 2504-4494

Source： Journal of Manufacturing and Materials Processing, Vol.2, Iss.1, 2018-03, pp. : 20-20

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