Enhancing the Thermal Stability of Solution‐Processed Small‐Molecule Semiconductor Thin Films Using a Flexible Linker Approach

Publisher: John Wiley & Sons Inc

E-ISSN: 1521-4095|27|37|5541-5546

ISSN: 0935-9648

Source: ADVANCED MATERIALS, Vol.27, Iss.37, 2015-10, pp. : 5541-5546

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Abstract