Publisher： Trans Tech Publications
E-ISSN： 1662-9779|2014|219|73-77
ISSN： 1012-0394
Source： Solid State Phenomena, Vol.2014, Iss.219, 2014-01, pp. : 73-77
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Analysis of Si Wet Etching Effect on Wafer Edge
Solid State Phenomena, Vol. 2016, Iss. 255, 2016-10 ,pp. :
Access to resources
Recommend
Wet Anisotropic Etching Characteristics of Si{100} in TMAH+Triton at near the Boiling Point
Key Engineering Materials, Vol. 2015, Iss. 645, 2015-06 ,pp. :
Study of Oxygen Concentration in TMAH Solution for Improvement of Sigma-Shaped Wet Etching Process
Solid State Phenomena, Vol. 2016, Iss. 255, 2016-10 ,pp. :
Oxygen Control for Wet Clean Process on Single Wafer Platform
Solid State Phenomena, Vol. 2016, Iss. 255, 2016-10 ,pp. :
Industrial Challenges of TiN Hard Mask Wet Removal Process for 14nm Technology Node
Solid State Phenomena, Vol. 2014, Iss. 219, 2014-01 ,pp. :