

Publisher: John Wiley & Sons Inc
E-ISSN: 1612-8869|12|10|1174-1185
ISSN: 1612-8850
Source: PLASMA PROCESSES AND POLYMERS (ELECTRONIC), Vol.12, Iss.10, 2015-10, pp. : 1174-1185
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content




Carrier gas effects on the selectivity in chemical vapor deposition of copper
By Kim S. Park J.-M. Choi D.-J.
Thin Solid Films, Vol. 315, Iss. 1, 1998-03 ,pp. :



