The effect of the ring opening polymerization and chain spacing on the coefficient of thermal expansion and modulus of polyimide

Publisher: John Wiley & Sons Inc

E-ISSN: 1097-4628|132|41|n/a-n/a

ISSN: 0021-8995

Source: JOURNAL OF APPLIED POLYMER SCIENCE, Vol.132, Iss.41, 2015-11, pp. : n/a-n/a

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Abstract