Exploration of Temperature Constraints for Thermal-Aware Mapping of 3D Networks-on-Chip

Publisher： IGI Global_journal

E-ISSN： 1947-9239|4|3|42-60

ISSN： 1947-9220

Source： International Journal of Adaptive, Resilient and Autonomic Systems (IJARAS), Vol.4, Iss.3, 2013-07, pp. : 42-60

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