Proposed Solution to the Problem of Thermal Stress Induced Failures in Medical Electronic Systems

Publisher: IGI Global_journal

E-ISSN: 2161-1629|3|2|33-41

ISSN: 2161-1610

Source: International Journal of Biomedical and Clinical Engineering (IJBCE), Vol.3, Iss.2, 2014-07, pp. : 33-41

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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Abstract