Investigation of Sn-Zn-Bi solders ‐ Part I: surface tension, interfacial tension and density measurements of SnZn7Bi solders

By Bukat K.   Moser Z.   Sitek J.   Gasior W.   Koscielski M.   Pstrus J.  

Soldering & Surface Mount Technology, Vol. 22, Iss. 3, 2010-01 ,pp. : 10-16

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Effect of Cu and Ni Addition on Microstructure and Wettability of Sn-Zn Solders

By  

Key Engineering Materials, Vol. 2017, Iss. 728, 2017-03 ,pp. : 9-14

Trans Tech Publications

Access to resources Recommend Favorite

Thermal Properties and Interfacial Reaction between the Sn-9Zn-xAg Lead-Free Solders and Cu Substrate

By Chang Tao-Chih   Wang Moo-Chin   Hon Min-Hsiung  

Metallurgical and Materials Transactions A, Vol. 36, Iss. 11, 2005-11 ,pp. : 3019-3029

Springer Publishing Company

Access to resources Recommend Favorite

Investigation of Sn-Zn-Bi solders ‐ Part II: wetting measurements on Sn-Zn7Bi solders on copper and on PCBs with lead-free finishes by means of the wetting balance method

By Bukat K.   Sitek J.   Koscielski M.   Moser Z.   Gasior W.   Pstrus J.  

Soldering & Surface Mount Technology, Vol. 22, Iss. 4, 2010-09 ,pp. : 13-19

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Interfacial Reactions Between Liquid Sn-8Zn-3Bi Solders and Cu Substrates

By Lin W. H.   Chuang T. H.  

Journal of Materials Engineering and Performance, Vol. 12, Iss. 4, 2003-08 ,pp. : 452-455

Springer Publishing Company

Access to resources Recommend Favorite