Growth behavior of voids randomly distributed at grain boundary on thin metal film with bamboo microstructures under thermal residual stress field and electric field

Author： Sun Yang   Liu Mabao   Lu Yi   Ren Xiang  

Publisher： Edp Sciences

E-ISSN： 1286-4854|111|6|66002-66002

ISSN： 0295-5075

Source： EPL (EUROPHYSICS LETTERS), Vol.111, Iss.6, 2015-10, pp. : 66002-66002

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