Mitigating Curtaining Artifacts During Ga FIB TEM Lamella Preparation of a 14 nm FinFET Device

Publisher： Cambridge University Press

E-ISSN： 1435-8115|23|3|484-490

ISSN： 1431-9276

Source： Microscopy and Microanalysis, Vol.23, Iss.3, 2017-03, pp. : 484-490

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