Enhanced thermal and mechanical properties of PW‐based HTPB binder using polystyrene (PS) and PS–SiO2 microencapsulated paraffin wax (MePW)

Publisher: John Wiley & Sons Inc

E-ISSN: 1097-4628|135|18|app.46222-app.46222

ISSN: 0021-8995

Source: JOURNAL OF APPLIED POLYMER SCIENCE, Vol.135, Iss.18, 2018-05, pp. : n/a-n/a

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Abstract