Temperature‐dependent modeling and performance analysis of coupled MLGNR interconnects

Publisher: John Wiley & Sons Inc

E-ISSN: 1097-007x|46|2|299-312

ISSN: 0098-9886

Source: INTERNATIONAL JOURNAL OF CIRCUIT THEORY AND APPLICATIONS, Vol.46, Iss.2, 2018-02, pp. : 299-312

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Abstract