Publisher: John Wiley & Sons Inc
E-ISSN: 2196-0216|5|3|523-530
ISSN: 2196-0216
Source: CHEMELECTROCHEM (ELECTRONIC), Vol.5, Iss.3, 2018-02, pp. : 523-530
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Research on HfSiN Diffusion Barrier Thin Film for Micro-Nanoscale ULSI-Cu Metallization
Materials Science Forum, Vol. 2014, Iss. 809, 2015-02 ,pp. :
Thin Solid Films, Vol. 365, Iss. 2, 2000-04 ,pp. :