Numerical investigation of fracture behavior of nanostructured Cu with bimodal grain size distribution

Author： Guo X.   Dai X.   Zhu L.   Lu J.  

Publisher： Springer Publishing Company

ISSN： 0001-5970

Source： Acta Mechanica, Vol.225, Iss.4-5, 2014-04, pp. : 1093-1106

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