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Author: Tansey C.W. Pluck P.
Publisher: Elsevier
ISSN: 0172-2190
Source: World Patent Information, Vol.26, Iss.1, 2004-03, pp. : 63-64
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
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