The effect of strain path and temperature on the microstructure developed in copper processed by ECAE

Author: Huang W.H.   Yu C.Y.   Kao P.W.   Chang C.P.  

Publisher: Elsevier

ISSN: 0921-5093

Source: Materials Science and Engineering: A, Vol.366, Iss.2, 2004-02, pp. : 221-228

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