

Author: Park S.J. Jung S.-H. Kim J.M. Cho H.-N.
Publisher: Elsevier
ISSN: 0928-4931
Source: Materials Science and Engineering: C, Vol.24, Iss.1, 2004-01, pp. : 99-102
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Related content








By Liang Hongwei Feng Qiuju Xia Xiaochuan Li Rong Guo Huiying Xu Kun Tao Pengcheng Chen Yuanpeng Du Guotong
Journal of Materials Science: Materials in Electronics, Vol. 25, Iss. 4, 2014-04 ,pp. :