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Emerald Group Publishing Ltd

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Interfacial Reaction between Sn-Ag-Cu-Mg Solder and ENIG Substrate

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Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing

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Solidification Condition Effects on Microstructures and Creep Resistance of Sn-3.8Ag-0.7Cu Lead-Free Solder

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Reflow profile study of the Sn-Ag-Cu solder

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