![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: Thanh T.
Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.24, Iss.4, 2013-04, pp. : 1389-1394
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Vertruyen B. Rulmont A. Cloots R. Fagnard J.-F. Ausloos M. Vandriessche I. Hoste S.
Journal of Materials Science, Vol. 40, Iss. 1, 2005-01 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Tarale A.
Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 4, 2013-04 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Zhang Shuyuan Cao Quanxi Zhang Maolin Cai Lei Yan Qidong
International Journal of Applied Ceramic Technology, Vol. 11, Iss. 4, 2014-07 ,pp. :