A novel MD/FE coupled model for numerical investigation of interfacial thermal resistance in MEMS/NEMS packaging

Author: Yang Ping  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5543

Source: Composite Interfaces, Vol.15, Iss.6, 2008-08, pp. : 561-575

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract