Evaluation of adhesion between glass/epoxy composite substrate and copper foil for printed circuit board applications

Author： Ikegawa Naoto   Hamada Hiroyuki   Yamanouchi Masahiro  

Publisher： Taylor & Francis Ltd

ISSN： 1568-5543

Source： Composite Interfaces, Vol.9, Iss.3, 2002-06, pp. : 235-245

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