![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: Jiang Meng
Publisher: Springer Publishing Company
ISSN: 0022-2461
Source: Journal of Materials Science, Vol.48, Iss.3, 2013-02, pp. : 1035-1041
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Chen Tao Zhang Ting Wang Guangchang Zhou Jifang Zhang Jianwei Liu Yuhong
Journal of Materials Science, Vol. 47, Iss. 11, 2012-06 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Luo Lingling Jiang Na Lei Fengying Guo Yongquan Zheng Qiaoji Lin Dunmin
Journal of Materials Science: Materials in Electronics, Vol. 25, Iss. 4, 2014-04 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Patel Satyanarayan Chauhan Aditya Vaish Rahul
International Journal of Applied Ceramic Technology, Vol. 12, Iss. 4, 2015-07 ,pp. :